SD78
Adhesive/High Pressure Lamination (HPL)
SD78 is a high solid content (60%), anionic, aqueous dispersion of a high gel , chloroprene - 2,3-dichlorobutadiene copolymer terminated with an alkyl xanthogen chain transfer agent. is is used as an Adhesive primarily in wood High Pressure Lamination (HPL) application, where especially hot bond strength at post-forming process is required such as production of wood to melamine upper board, counter desk. It is also suitable for adhesives with medium range bond strength and can be used for wet suits assembly. It features Hot Bond / Hot Creep resistance which stands post-forming for improved processing. It has good contactability and high solid content. It has excellent solvent resistance and a medium crystallization rate. Storage stability is good. pH decreases with time depending on temperature and air exposure. This decrease is indicative of structural changes in the polymer and alterations in the colloidal properties of the latex which are not readily measured. To keep changes to a minimum it is recommended that the material be stored low and temperatures between 5-40ºC, ideally between 13-21ºC with as little contact with air as possible.
DATA SHEET
| PROPERTY | VALUE | TEST METHOD |
| Appearance | Liquid | Visual |
| Colour | Opaque White | Visual |
| Contamination | None | Visual |
| Solids % w/w | 59.5-61.5 | SN300 - 9000S |
| Gel Content | Medium-High | - |
| pH at 25ºC | 12.0 min. | SP320 - 3000S |
| Crystallization Rate | Fast-medium | - |
| Polarity | Anionic | - |
| Polymer Structure | Copolymer | - |
| Other Characteristics | Wood high pressure laminate. | - |
| The above is typical data and it is not guaranteed by either Showa Denko or SEL. |